Faivpela Leya Vertikal Plasma Ikwipmen

Ol i wokim 'Five-Layer Vertical Plasma Equipment wantaim ful otomatik operesen, wantaim PLC + tats skrin + maus na kibod kontrol bilong wanpela yusa-prenli na gutpela intafeis. Olgeta proses paramita i ken stap fri na lukluk long en long taim stret, na dispela i mekim na ol i ken stap gut na ol i ken mekim gen long olgeta taim bilong prodaksen.

Askim wok painimaut

Diskripsen bilong wok

Ol i wokim 'Five-Layer Vertical Plasma Equipment' wantaimful otomatik operesen, bungimPLC + tats skrin + maus na kibod kontrolbilong wanpela yusa-prenli na gutpela intafeis. Olgeta proses paramita i ken stap fri na lukluk long en long taim stret, na dispela i mekim na ol i ken stap gut na ol i ken mekim gen long olgeta taim bilong prodaksen. Dispela sistem i gat ol alam na rekoding bilong data tu long toksave hariap long ol opereta sapos i gat wanpela samting i no stret, na dispela i mekim wok i seif na i go het.

Ol bikpela samting (konfiguresen)

Kabot

Ol i wokim long ol gutpela ain plet wantaim wanpela 'textured powder coating' pinis. Pes bilong kebinet em i no inap bagarap, em i save stap longpela taim, na ol i wokim long gutpela lukluk longwaitpela kala, na dispela i mekim em i gutpela long ol klinpela rum bilong nau.

Ol Plet Bilong Elektrod

Ol i wokim long strongpela 'aerospace-grade aluminium long rot bilong wanpela 'advanced deep-hole integral molding process'. Wanwan plet i skelim1355mm × 850mm, wantaim wanpela total bilong6-pela pletlong givim gutpela wok na wankain plasma tritmen.

Ol bikpela aplikesen

Dispela sistem em ol i save yusim pastaim longPCB (Printed Circuit Board) klinim pes. Em i save rausim ol liklik hap samting, ol 'residual resin', ol 'organic contaminants', na ol 'oxide layers'. Long rot bilong mekim wok bilong 'surface activation' i kamap gutpela moa, 'plasma process' i save strongim 'adhesion', 'bonding strength', 'solderability', na 'reability' bilong ol narapela wok olsem 'coating', 'lamination', na 'welding'.

Teknikel Spesifikasen

Loading Cart

I gat tupela kat bilong putim kago, na wan wan i gat650mm × 1610mm × 1450mm × 2PCS, wok long narapela narapela rot long mekim prodaksen i kamap gutpela na daunim taim bilong stap nating.

Ol Proses Ges

I stret wantaimNitrogen, Oxygen, Hydrogen, na Argon. Ges saplai sistem i yusimKOJIMA (Japan brand)ol komponen, na mekim gutpela stebiliti na durability.

Flow Control

Stretpela bilong 'flow meter' em±1.5% F.S, wantaim ripit bilong±0.2% F.S. Olgeta sil em ol i wokim long 'corrosion-resistantViton (FKM) raba.

Flow Range

Ol mita bilong ges i save givim bikpela kontrol bilong0–2000 ml/min, yu ken stretim bihainim ol samting yu mas mekim, na dispela i mekim na ol i ken yusim ol kain kain rot bilong stretim PCB.

Veliu bilong aplikesen

Dispela 5-leia vertikal plasma ikwipmen em i gutpela samting bilong wokim bikpela volium PCB. Em i helpim tru long apim prodak yield na proses konsistensi. Long rot bilong klinim na kirapim gut 'plasma surface', dispela sistem i save strongim wok bilong 'solder', 'bonding', na 'coating'. Ol i wokim wantaim lukluk longyusim gut pawa, no bagarapim envairomen, na isi long lukautim, dispela ikwipmen i gat gutpela pefomens level na planti kampani bilong wokim ol samting bilong elektronik, semikondakta pakejing, na tes i save yusim.

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