FPC Vertikal Plasma Ikwipmen

FPC Vertical Plasma Equipment em ol i wokim bilong kirapim ol 'surface activation' bilong ol 'rigid-flex PCBs' na 'flexible PCBs' (FPCs). Taim ol i yusim plasma teknoloji, dispela i save mekim strong bilong pes i go antap, na i save strongim 'adhesion' na 'reliability' bilong ol wok bilong putim 'coating', 'bonding', 'printing', o 'copper plating'. Sistem i sapotim ful otomatik operesen na i gat ol samting bilong lukluk long taim tru na sefti proteksen, na dispela i mekim wok bilong en i stap gut taim wok i wok long kamap oltaim.

Askim wok painimaut

Diskripsen bilong wok

FPC Vertical Plasma Equipment em ol i wokim bilong'surface activation' bilong ol 'rigid-flex PCBs' na 'flexible PCBs' (FPCs). Taim ol i yusim plasma teknoloji, dispela i save mekim strong bilong pes i go antap, na i save strongim 'adhesion' na 'reliability' bilong ol wok bilong putim 'coating', 'bonding', 'printing', o 'copper plating'. Sistem i sapotim ful otomatik operesen na i gat ol samting bilong sekim na sefti long taim stret, na dispela i mekim wok bilong en i stap gut taim ol i wok long kamapim ol samting. Em i gutpela tru long ol prodaksen lain we i nidim bikpela-presisen na bikpela-reliabiliti FPC pes tritmen.

Ol bikpela samting (konfiguresen)

Tempereture Transmitter

I gatS4-TT-RI-3-5, we i save givim 'real-monitoring bilong plasma rum tempereja long holim gutpela prosesing kondisen.

Senisim pawa saplai

Indastrial-greidIQ-60F (±15V/24V)pawa saplai i save mekim gutpela na stretpela eneji i kamap, na i save holim gutpela na stretpela plasma autput.

Ol bikpela aplikesen

Dispela masin em ol i save yusim pastaim longFPC surface activation, rausim ol 'micro-contaminants na tu i mekim 'surface energy' na wok i go antap. Dispela tritmen i save helpim long pas gut long ol narapela wok olsem 'copper plating', 'coating', na 'bonding', na dispela i save strongim tru 'yield', 'surface reliability', na 'product consistency'. Em i gutpela tru long ol bikpela wok bilong wokim ol samting bilong elektronik we wok bilong wokim ol samting i stret na i no senis senis em i bikpela samting.

Teknikel Spesifikasen

Presa bilong wara i kol

>1 bar, i mekim gutpela kontrol bilong tempereja taim yu wok longpela taim na lukautim ol bikpela samting.

Sefti Proteksen Sistem

I gat ol samting bilong lukautim ges sot, presa proteksen, na seket proteksen, we i save stopim ol hevi long wok aninit long ol samting we i no stret na i save lukautim gut opereta na prodaksen.

Veliu bilong aplikesen

FPC vertikal plasma ikwipmen i save givim wanpelagutpela, gutpela tingting, na gutpela rot bilong kirapim ol samtingbilong ol kampani i wokim ol samting bilong elektronik. Em i save helpim tru long pas gut na wok bilong ol FPC na ol strongpela -fleks bod, na i save strongim gutpela na wankain pasin bilong koting, kopa pleting, na bonding proses. Wantaim bikpela -presisen tempereja kontrol, indastriel-greid pawa saplai, na ol gutpela sefti proteksen, sistem i save skruim laipspan bilong ol ikwipmen na tu i save daunim ol hevi bilong wok na ol kos bilong lukautim. Long wok bilong wokim ol gutpela samting bilong elektronik, bungim ol FPC, na putim ol samting long ol gutpela samting, dispela ikwipmen em i wanpela bikpela tul bilong winimbikpela kaikai, wankain kwaliti, na gutpela prodaksen.

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