PCB Vertikal Plasma Ikwipmen
PCB Vertical Plasma Equipment em ol i save yusim pastaim long PCB PTH (Plated Through-Hole) tritmen na pre-solder mask (SMT) redim pes. Em i yusim 'high-efficiency plasma cleaning technology, na em i rausim ol doti, gris, na ol 'resin' we i stap yet na tu em i kirapim PCB pes long strongim 'adhesion' bilong ol wok bilong putim 'solder mask' na 'copper plating'.
Diskripsen bilong wok
PCB Vertical Plasma Equipment em ol i save yusim pastaim longPCB PTH (Plated Through-Hole) tritmen na pre-solder mask (SMT) redim pes. Em i yusim 'high-efficiency plasma cleaning technology, na em i rausim ol doti, gris, na ol 'resin' we i stap yet na tu em i kirapim PCB pes long strongim 'adhesion' bilong ol wok bilong putim 'solder mask' na 'copper plating'. Sistem i sapotim ful otomatik operesen wantaim ril-taim monitoring na alam fanksen, na mekim gutpela wok na prodaksen sefti. Em i kamap bilong inapim ol bikpela -presisen rikwaemen bilong wokim PCB long mekim gutpela na gutpela tritmen long pes bilong en.
Ol bikpela samting (konfiguresen)
Presa Transmita
I gat wanpela 'high-precision 'vacuum detector' bilong lukluk long 'vacuum chamber' long taim tru, na dispela i mekim wok bilong tritim 'plasma' i stap gut na i ken wok gut.
Ol samting bilong bosim lektrik
Insait long indastrial-greidSchneider LC1D0845ol masin bilong mekim wok i stap gut longpela taim, strongim otomesen, na mekim sefti i kamap gutpela moa.
Sistem bilong wara i kol
I yusim wanpelaUS-brand frijiresen kompresa, ol i kisim olgeta-stainles stiel wara pam na paiplain, na envairomen frenli refrigerant. Dispela i mekim na 'plasma chamber' na ol bikpela samting bilong en i stap gut taim ol i wok longpela taim, na dispela i mekim na ol ikwipmen i stap longpela taim na i no yusim planti pawa.
Ol bikpela aplikesen
Ol ikwipmen i gutpela longPTFE desmearna bilongPCB klinim na kirapim pes bilong en pastaim long PTH pleting. Plasma tritmen i save rausim ol pipia, ol doti samting, na ol liklik hap samting i stap yet bihain long drilim o laser prosesim, na tu i save apim strong bilong pes. Dispela i mekim gutpela wok long 'adhesion' bilong 'solder mask coating' na 'metal plating', na i mekim gutpela 'yield' na 'product stability' long wokim PCB.
Teknikel Spesifikasen
Maksimum Ges Inlet Flo
Liklik o wankain olsem 2000 ml/min, yu ken stretim long inapim ol spesifik proses rikwaemen na mekim tritmen i kamap wankain.
Taim bilong prosesim
20-60 minit, em i isi long tanim na stretim long stretim ol kain kain tiknes bilong ol samting na ol kondisen bilong proses.
Veliu bilong aplikesen
Ol PCB vertikal plasma ikwipmen i save givim ol kampani bilong wokim ol samting bilong elektronik wantaim wanpelagutpela tru, yu ken bilip long en, na i no bagarapim envairomen. Wantaim stretpela kontrol bilong ges ron, gutpela 'vacuum monitoring', na ol 'industrial-gred' lektrikel komponen, dispela i save helpim gut tru 'yield' na 'consistency' bilong PTH pleting, 'solder mask coating', na PTFE desmear proses. Gutpela kol wara sistem bilong en na eco-frendli disain bilong en i mekim em i stap longpela taim na tu i daunim ol kos bilong wok na eneji konsumsen. Dispela gutpela plasma sistem em i wanpela bikpela tul bilong wokim ol PCB bilong nau, na em i gutpela long wokim ol PCB namel long - i go inap long -hai-en na ol bikpela wok bilong ilektronik.
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