
Vacuum Inline RF Plasma Equipment
'Vacuum Inline RF plasma Equipment' em i wanpela spesel samting we ol i wokim bilong klinim na kirapim ol 'printed circuit board surface', moa yet long ol 'IC substrate' aplikesen. Ol i save yusim moa yet bihain long 'dry film imaging stage' na bihain long '-solda mask koting, we stretpela redi bilong pes em i bikpela samting long strongim 'adhesion' na mekim gutpela 'reliability' long ol narapela wok bihain. Taim ol i putim plasma tritmen insait long wanpela 'vacuum chamber' we ol i bosim, dispela sistem i save rausim ol 'organic residues' na ol samting nogut i stap antap long en, na dispela i save strongim wok bilong 'bonding' na 'product quality'.
Diskripsen bilong ol prodak
'Vacuum Inline RF plasma Equipment' em i wanpela spesel samting we ol i wokim bilong klinim na kirapim ol 'printed circuit board surface', moa yet long ol 'IC substrate' aplikesen. Ol i save yusim moa yet bihain long 'dry film imaging stage' na bihain long '-solda mask koting, we stretpela redi bilong pes em i bikpela samting long strongim 'adhesion' na mekim gutpela 'reliability' long ol narapela wok bihain. Taim ol i putim plasma tritmen insait long wanpela 'vacuum chamber' we ol i bosim, dispela sistem i save rausim ol 'organic residues' na ol samting nogut i stap antap long en, na dispela i save strongim wok bilong 'bonding' na 'product quality'.
Wanpela samting we i narakain long dispela ikwipmen em tupela-rum akiteksa bilong en. Olgeta wan wan rum i gat wanpela 'vacuum pump' na wanpela 'RF plasma generator', na dispela i mekim na ol i ken wok wantaim o yusim long narapela narapela taim. Dispela i no save apim 'throughput' tasol tu i save givim 'operational flexibility'. Long holim strong longpela taim, sistem i gat wanpela 'closed-cooling module' we i save mekim wok bilong ol pam na ol 'plasma source' i stap wankain. Long ol prodaksen lain we i nidim otomesen, ol i ken putim ol opsenel loading na unloding mekanisme long daunim wok bilong han na helpim koneksen wantaim ol apstrim na daunstrim ikwipmen.
Ol i wokim gut ol samting i ron insait long sistem. Ol i save salim ol bod i go long input stesin na ol robotik gripa i save pasim ol, na bihain ol i save putim ol sabstret insait long wanpela sab-freim. Wanpela eleveta pletfom na ol 'driven rollers' i sapotim ol bod, na ol i kisim ol i go insait long 'vacuum chamber' bilong kisim 'plasma' tritmen. Taim wok i pinis, ol wankain rola i save kisim ol bod i go ausait long rum, we ol 'grippers' i save kisim gen na givim i go long narapela step. Sab-freim i save raun namel long ol stesin, na dispela i mekim wok i ron gut na i no gat taim bilong malolo.

Ges delivery tu i gutpela long mekim i wankain. Ol i save miksim ol 'reactive gas' long wanpela 'manifold' pastaim long ol i putim i go insait long rum long antap na daunbilo inlet, na dispela i mekim na plasma i ken go aut long olgeta hap. Long taim bilong 'exhaust', ol i save putim 'compressed air' i go insait long rum bilong mekim 'pressure release' i go hariap, na dispela i save daunim taim bilong 'idle' na mekim wok bilong 'cycle' i kamap gutpela moa. Wantaim strongpela wok bilong en, gutpela wok, na otomesen-redi disain, dispela plasma klinim sistem i givim wanpela gutpela rot bilong wokim ol gutpela IC sabstret.
Hot Tag: vekim inlain rf plasma ikwipmen, Saina vekim inlain rf plasma ikwipmen manifakta, faktori
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